The module also uses the Intel HM55 Express mobile chipset, which measures 25 by 27mm and supports up to 8Gbyte (1066MT/s) dual channel DDR3 memory. The integrated graphics controller supports the Intel FDI flexible display interface, enabling two independent video channels on VGA, LVDS, HDMI, Display Port and SDVO interfaces.
The type two pin-out provides high performance graphics, making it suitable for low-power, graphics-intensive applications such as those found in the gaming market or in medical imaging systems.
The integrated Intel Turbo Boost Technology can over-clock a processor core if the second core operates at low capacity.
To keep power consumption at about the same level as earlier processor generations, the Core i7 processor supports the latest low-power modes. Through the use of Intel’s Core C6 state, where the processor status is stored in a dedicated sram, the cores can be switched off, reducing power consumption to almost zero. The fact that the individual cores can assume C6 status independently of one another helps increase power efficiency.
Five PCI Express lanes, eight USB 2.0 ports, three serial ATA ports, EIDE and one Gigabit Ethernet interface enable flexible system extensions while providing higher data bandwidths. An LPC bus is available for slower expansions as well as a fan controller and an Intel high-definition audio interface.